FirePro M3900
General
ManufacturerAMD
SeriesFirePro Mobile(Mx900)
GPU NameSeymour
ArchitectureTeraScale 2
GenerationFirePro Mobile(Mx900)
Release DateOct 2010
Bus InterfacePCIe 2.0 x16
Process & Die
FoundryTSMC
Process Size40 nm
Transistors370 M
Transistor Density5,500 K/mm²
Die Size67 mm²
Chip PackageFCBGA-631/962
Clock Speeds
Base Clock750 MHz
Boost Clock750 MHz
Memory
VRAM1 GB
Memory TypeGDDR3
Memory Clock900 MHz
Memory Bus64-bit
Bandwidth14.4 GB/s
Processing Units
Shading Units160
TMUs8
ROPs4
SMs0
Tensor Cores0
RT Cores0
Cache
L1 Cache8 KB
L2 Cache0.128 MB
Power & Thermals
TDP20 W
Dimensions
Outputs
API Support
DirectX11.0
OpenGL4.4
OpenCL1.2
Shader Model5.0
Theoretical Performance
Pixel Rate3 GP/s
Texture Rate6 GT/s
FP32 (Single)240 GFLOPS
External
TechPowerUpView →
Other FirePro Mobile(Mx900) Models