Radeon R2E Mobile Graphics

General
ManufacturerAMD
SeriesGCN 3.0 IGP(Stoney Ridge-M)
GPU NameStoney
ArchitectureGCN 3.0
GenerationGCN 3.0 IGP(Stoney Ridge-M)
Release DateJun 2016
Bus InterfaceIGP
Process & Die
FoundryGlobalFoundries
Process Size28 nm
Transistors1,200 M
Transistor Density9,600 K/mm²
Die Size125 mm²
Chip PackageµBGA
Clock Speeds
Base Clock200 MHz
Boost Clock600 MHz
Memory
VRAM0 GB
Memory TypeSystem Shared
Processing Units
Shading Units128
TMUs8
ROPs4
SMs0
Tensor Cores0
RT Cores0
Cache
L2 Cache0 MB
Power & Thermals
TDP15 W
Power ConnectorsNone
Dimensions
Outputs
API Support
DirectX12.0
OpenGL4.6
Vulkan1.2
OpenCL2.1
Shader Model6.5
Theoretical Performance
Pixel Rate2.4 GP/s
Texture Rate4.8 GT/s
FP16 (Half)153.6 GFLOPS
FP32 (Single)153.6 GFLOPS
FP64 (Double)9.6 GFLOPS
External
TechPowerUpView →